Assignee

ERNULT FRANCK

JP·1 granted patent·2 citations·filing 2010–2010

Technology mixC23C1 H01J1 H01L1 H10P1

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0157US8877019B2Sputtering apparatus, sputter deposition method, and analysis apparatusERNULT FRANCK·Filed 2010·Granted Nov 4, 2014·2 cites·11 claims

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