Assignee
ESEC SA
CH18 patents
Top patents by PatentIndex Score
US5569402AOct 29, 1996
Curing oven for magazine holding computer chip lead frames, providing flow direction control for hot gas stream
ESEC SA348 citations97
US5878939AMar 9, 1999
Method and apparatus for dispensing liquid solder
ESEC SA55 citations91
US6185815B1Feb 13, 2001
Semiconductor mounting apparatus with a chip gripper travelling back and forth
ESEC SA42 citations90
US5199630AApr 6, 1993
Method and apparatus for measuring the vibration amplitude on an energy transducer
ESEC SA32 citations89
US5114302AMay 19, 1992
Apparatus for performing in-feed of working member to working station
ESEC SA37 citations89
US6179938B1Jan 30, 2001
Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder
ESEC SA33 citations88
US6135339AOct 24, 2000
Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
ESEC SA33 citations88
US6056184AMay 2, 2000
Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips
ESEC SA20 citations88
US6129040AOct 10, 2000
Semi-conductor mounting apparatus for applying adhesive to a substrate
ESEC SA34 citations84
US5163222ANov 17, 1992
Method and apparatus for loading metal leadframes with electronic components
ESEC SA25 citations82
US5263631ANov 23, 1993
Contact-making system for semiconductor wire connections
ESEC SA20 citations81
US6119926ASep 19, 2000
Method for producing wire connections on semiconductor chips
ESEC SA17 citations76
US4903883AFeb 27, 1990
Apparatus for ultrasonic contacting wire connection of circuits to electronic components
ESEC SA20 citations75
US6131799AOct 17, 2000
Method of making wire connections of predetermined shape
ESEC SA11 citations69
US5893509AApr 13, 1999
Apparatus for making wire connections on semiconductor chips
ESEC SA16 citations69
US5108023AApr 28, 1992
Device for forming electric circuits on a lead frame
ESEC SA14 citations69
US5598270AJan 28, 1997
Sensor device and position determination process and their use for the control of an insertion robot
ESEC SA9 citations66
US6010057AJan 4, 2000
Method for making a wire connections of predetermined shape
ESEC SA8 citations65