Assignee
EU POH LENG
MY·2 granted patents·1 pending application·9 citations·filing 2011–2014
Top patents by PatentIndex Score
3 records- 0179US9030000B2Mold cap for semiconductor deviceEU POH LENG·Filed 2013·Granted May 12, 2015·6 cites·8 claims
- 0277US8198143B2Mold and substrate for use with moldEU POH LENG·Filed 2011·Granted Jun 12, 2012·3 cites·5 claims
- 0341US2015235981A1Wire bonding method with two step free air ball formationEU POH LENG·Filed 2014·Application pending·0 cites
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