Assignee
FARADAY TECH MARKETING GROUP
US·17 granted patents·843 citations·filing 1998–2003
Top patents by PatentIndex Score
17 records- 0197US6558231B1Sequential electromachining and electropolishing of metals and the like using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2000·Granted May 6, 2003·50 cites·17 claims
- 0296US6524461B2Electrodeposition of metals in small recesses using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2001·Granted Feb 25, 2003·76 cites·78 claims
- 0393US6319384B1Pulse reverse electrodeposition for metallization and planarization of semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 2000·Granted Nov 20, 2001·85 cites·24 claims
- 0493US6303014B1Electrodeposition of metals in small recesses using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2000·Granted Oct 16, 2001·98 cites·32 claims
- 0593US6210555B1Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse platingFARADAY TECH MARKETING GROUP·Filed 1999·Granted Apr 3, 2001·88 cites·44 claims
- 0692US6750144B2Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizesFARADAY TECH MARKETING GROUP·Filed 2003·Granted Jun 15, 2004·77 cites·18 claims
- 0791US6402931B1Electrochemical machining using modulated reverse electric fieldsFARADAY TECH MARKETING GROUP·Filed 1998·Granted Jun 11, 2002·86 cites·17 claims
- 0891US6309528B1Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizesFARADAY TECH MARKETING GROUP·Filed 1999·Granted Oct 30, 2001·73 cites·23 claims
- 0986US6203684B1Pulse reverse electrodeposition for metallization and planarization of a semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 1998·Granted Mar 20, 2001·86 cites·21 claims
- 1085US6652727B2Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizesFARADAY TECH MARKETING GROUP·Filed 2002·Granted Nov 25, 2003·20 cites·57 claims
- 1183US6551485B1Electrodeposition of metals for forming three-dimensional microstructuresFARADAY TECH MARKETING GROUP·Filed 2000·Granted Apr 22, 2003·15 cites·17 claims
- 1280US6827833B2Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fieldsFARADAY TECH MARKETING GROUP·Filed 2001·Granted Dec 7, 2004·12 cites·28 claims
- 1379US6863793B2Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizesFARADAY TECH MARKETING GROUP·Filed 2001·Granted Mar 8, 2005·11 cites·35 claims
- 1472US6221235B1Removal of sacrificial cores by electrochemical machiningFARADAY TECH MARKETING GROUP·Filed 1998·Granted Apr 24, 2001·29 cites·15 claims
- 1567US6878259B2Pulse reverse electrodeposition for metallization and planarization of semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 2001·Granted Apr 12, 2005·11 cites·24 claims
- 1660US7022216B2Electrolytic etching of metal layersFARADAY TECH MARKETING GROUP·Filed 2003·Granted Apr 4, 2006·11 cites·29 claims
- 1754US6676825B1Removal of sacrificial cores by electrochemical machiningFARADAY TECH MARKETING GROUP·Filed 1999·Granted Jan 13, 2004·15 cites·5 claims
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