Assignee
FASFORD TECH CO LTD
JP·8 granted patents·8 pending applications·6 citations·filing 2015–2025
Top patents by PatentIndex Score
16 records- 0184US9530751B2Die bonder and bonding methodFASFORD TECH CO LTD·Filed 2015·Granted Dec 27, 2016·6 cites·18 claims
- 0270US2025253169A1Die Bonding Apparatus and Manufacturing Method for Semiconductor ApparatusFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 0367US12374576B2Semiconductor manufacturing apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·18 claims
- 0462US12327739B2Die bonding apparatus and manufacturing method for semiconductor apparatusFASFORD TECH CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·7 claims
- 0561US2025096188A1Die Bonding Apparatus, Mounting Method, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2024·Application pending·0 cites
- 0659US11569118B2Semiconductor manufacturing apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·4 claims
- 0755US2023290666A1Semiconductor manufacturing apparatus, carrier jig, and manufacturing method of semiconductor deviceFASFORD TECH CO LTD·Filed 2023·Application pending·0 cites
- 0851US2023215770A1Semiconductor manufacturing apparatus, inspection apparatus, and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Application pending·0 cites
- 0951US2023090693A1Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Application pending·0 cites
- 1050US2024312825A1Semiconductor Manufacturing Device, Push-up Unit, and Method of Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2024·Application pending·0 cites
- 1149US2025285892A1Semiconductor Manufacturing Apparatus, Pushup Method, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 1248US12068275B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·19 claims
- 1348US2025279304A1Semiconductor Manufacturing Apparatus, Pushup Unit, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 1443US11692947B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1540US12053806B2Die bonding apparatus, cleaning head and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·3 claims
- 1639US12588457B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·4 claims
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