Assignee
FAY OWEN R
US·3 granted patents·1 pending application·18 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0190US8435836B2Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methodsFAY OWEN R·Filed 2011·Granted May 7, 2013·9 cites·14 claims
- 0288US8659153B2Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methodsFAY OWEN R·Filed 2012·Granted Feb 25, 2014·9 cites·29 claims
- 0353US9646899B2Interconnect assemblies with probed bond padsFAY OWEN R·Filed 2012·Granted May 9, 2017·0 cites·30 claims
- 0441US2007212813A1Perforated embedded plane package and methodFAY OWEN R·Filed 2006·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →