Assignee
FEFER YEFIM-HAIM
IL·2 granted patents·4 citations·filing 2008–2009
Technology mixG01R2
Top patents by PatentIndex Score
2 records- 0157US8531197B2Integrated circuit die, an integrated circuit package and a method for connecting an integrated circuit die to an external deviceFEFER YEFIM-HAIM·Filed 2008·Granted Sep 10, 2013·3 cites·20 claims
- 0241US9097758B2Connection quality verification for integrated circuit testFEFER YEFIM-HAIM·Filed 2009·Granted Aug 4, 2015·1 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →