Assignee
FENG CHIEN-TE
TW·3 granted patents·2 pending applications·6 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0165US8058706B2Delamination resistant packaged die having support and shaped die having protruding lip on supportFENG CHIEN-TE·Filed 2009·Granted Nov 15, 2011·5 cites·17 claims
- 0257US8456021B2Integrated circuit device having die bonded to the polymer side of a polymer substrateFENG CHIEN-TE·Filed 2010·Granted Jun 4, 2013·1 cites·21 claims
- 0341US8274140B2Semiconductor chip package assembly with deflection-resistant leadfingersFENG CHIEN-TE·Filed 2011·Granted Sep 25, 2012·0 cites·4 claims
- 0440US2012276692A1Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant LeadfingersFENG CHIEN-TE·Filed 2012·Application pending·0 cites
- 0536US2010295168A1Semiconductor package using conductive plug to replace solder ballFENG CHIEN-TE·Filed 2009·Application pending·0 cites
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