Assignee
FENG TAO
US12 patents
Top patents by PatentIndex Score
US8217748B2Jul 10, 2012
Compact inductive power electronics package
FENG TAO18 citations84
US8987878B2Mar 24, 2015
Substrateless power device packages
FENG TAO5 citations72
US8507362B2Aug 13, 2013
Process of forming ultra thin wafers having an edge support ring
FENG TAO2 citations63
US8466060B2Jun 18, 2013
Stackable power MOSFET, power MOSFET stack, and process of manufacture
FENG TAO4 citations63
US8242013B2Aug 14, 2012
Virtually substrate-less composite power semiconductor device and method
FENG TAO2 citations63
US8058727B2Nov 15, 2011
Standing chip scale package
FENG TAO2 citations63
US8716063B2May 6, 2014
Wafer level chip scale package and process of manufacture
FENG TAO2 citations62
US8866267B2Oct 21, 2014
Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
FENG TAO1 citations52
US8796858B2Aug 5, 2014
Virtually substrate-less composite power semiconductor device
FENG TAO0 citations52
US8294254B2Oct 23, 2012
Chip scale surface mounted semiconductor device package and process of manufacture
FENG TAO0 citations52
US8222078B2Jul 17, 2012
Chip scale surface mounted semiconductor device package and process of manufacture
FENG TAO1 citations52
US8198285B2Jun 12, 2012
Pyrazine derivatives
FENG TAO1 citations50