Assignee
FLIPCHIP INT LLC
US9 patents
Top patents by PatentIndex Score
US6919508B2Jul 19, 2005
Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
FLIPCHIP INT LLC85 citations96
US7011988B2Mar 14, 2006
Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing
FLIPCHIP INT LLC59 citations94
US7057292B1Jun 6, 2006
Solder bar for high power flip chips
FLIPCHIP INT LLC30 citations92
US7973418B2Jul 5, 2011
Solder bump interconnect for improved mechanical and thermo-mechanical performance
FLIPCHIP INT LLC27 citations89
US9627254B2Apr 18, 2017
Method for building vertical pillar interconnect
FLIPCHIP INT LLC7 citations79
US8686556B2Apr 1, 2014
Wafer level applied thermal heat sink
FLIPCHIP INT LLC6 citations72
US7118833B2Oct 10, 2006
Forming partial-depth features in polymer film
FLIPCHIP INT LLC5 citations62
US9070747B2Jun 30, 2015
Electroplating using dielectric bridges
FLIPCHIP INT LLC1 citations45
US8980743B2Mar 17, 2015
Method for applying a final metal layer for wafer level packaging and associated device
FLIPCHIP INT LLC1 citations41