Assignee
FORMFACTOR INC
US·455 granted patents·81 pending applications·32,054 citations·filing 1993–2025
Top patents by PatentIndex Score
536 records- 0199US7928750B2Contactless interfacing of test signals with a device under testFORMFACTOR INC·Filed 2008·Granted Apr 19, 2011·133 cites·14 claims
- 0299US7225538B2Resilient contact structures formed and then attached to a substrateFORMFACTOR INC·Filed 2001·Granted Jun 5, 2007·206 cites·49 claims
- 0399US6913468B2Methods of removably mounting electronic components to a circuit board, and sockets formed by the methodsFORMFACTOR INC·Filed 2003·Granted Jul 5, 2005·154 cites·26 claims
- 0499US6838893B2Probe card assemblyFORMFACTOR INC·Filed 2003·Granted Jan 4, 2005·155 cites·19 claims
- 0599US6835898B2Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structuresFORMFACTOR INC·Filed 2000·Granted Dec 28, 2004·174 cites·5 claims
- 0699US6811406B2Microelectronic spring with additional protruding memberFORMFACTOR INC·Filed 2001·Granted Nov 2, 2004·270 cites·49 claims
- 0799US6778406B2Resilient contact structures for interconnecting electronic devicesFORMFACTOR INC·Filed 2000·Granted Aug 17, 2004·247 cites·23 claims
- 0899US6741085B1Contact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 1997·Granted May 25, 2004·175 cites·19 claims
- 0999US6729019B2Method of manufacturing a probe cardFORMFACTOR INC·Filed 2001·Granted May 4, 2004·185 cites·24 claims
- 1099US6690185B1Large contactor with multiple, aligned contactor unitsFORMFACTOR INC·Filed 1998·Granted Feb 10, 2004·268 cites·8 claims
- 1199US6616966B2Method of making lithographic contact springsFORMFACTOR INC·Filed 2001·Granted Sep 9, 2003·179 cites·8 claims
- 1299US6525555B1Wafer-level burn-in and testFORMFACTOR INC·Filed 2000·Granted Feb 25, 2003·164 cites·52 claims
- 1399US6509751B1Planarizer for a semiconductor contactorFORMFACTOR INC·Filed 2000·Granted Jan 21, 2003·314 cites·25 claims
- 1499US6482013B2Microelectronic spring contact element and electronic component having a plurality of spring contact elementsFORMFACTOR INC·Filed 1997·Granted Nov 19, 2002·272 cites·14 claims
- 1599US6468098B1Electrical contactor especially wafer level contactor using fluid pressureFORMFACTOR INC·Filed 1999·Granted Oct 22, 2002·153 cites·48 claims
- 1699US6339338B1Apparatus for reducing power supply noise in an integrated circuitFORMFACTOR INC·Filed 2000·Granted Jan 15, 2002·167 cites·22 claims
- 1799US6255126B1Lithographic contact elementsFORMFACTOR INC·Filed 1998·Granted Jul 3, 2001·410 cites·38 claims
- 1899US6218910B1High bandwidth passive integrated circuit tester probe card assemblyFORMFACTOR INC·Filed 1999·Granted Apr 17, 2001·251 cites·22 claims
- 1999US6208225B1Filter structures for integrated circuit interfacesFORMFACTOR INC·Filed 1999·Granted Mar 27, 2001·225 cites·39 claims
- 2099US6110823AMethod of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a methodFORMFACTOR INC·Filed 1998·Granted Aug 29, 2000·299 cites·40 claims
- 2199US6064213AWafer-level burn-in and testFORMFACTOR INC·Filed 1997·Granted May 16, 2000·416 cites·56 claims
- 2299US6050829AMaking discrete power connections to a space transformer of a probe card assemblyFORMFACTOR INC·Filed 1997·Granted Apr 18, 2000·252 cites·3 claims
- 2399US6032356AWafer-level test and burn-in, and semiconductor processFORMFACTOR INC·Filed 1997·Granted Mar 7, 2000·275 cites·19 claims
- 2499US6029344AComposite interconnection element for microelectronic components, and method of making sameFORMFACTOR INC·Filed 1998·Granted Feb 29, 2000·373 cites·15 claims
- 2599US5994152AFabricating interconnects and tips using sacrificial substratesFORMFACTOR INC·Filed 1997·Granted Nov 30, 1999·409 cites·60 claims
- 2699US5974662AMethod of planarizing tips of probe elements of a probe card assemblyFORMFACTOR INC·Filed 1995·Granted Nov 2, 1999·649 cites·35 claims
- 2799US5917707AFlexible contact structure with an electrically conductive shellFORMFACTOR INC·Filed 1994·Granted Jun 29, 1999·556 cites·13 claims
- 2899US5864946AMethod of making contact tip structuresFORMFACTOR INC·Filed 1997·Granted Feb 2, 1999·289 cites·12 claims
- 2999US5832601AMethod of making temporary connections between electronic componentsFORMFACTOR INC·Filed 1997·Granted Nov 10, 1998·264 cites·11 claims
- 3099US5829128AMethod of mounting resilient contact structures to semiconductor devicesFORMFACTOR INC·Filed 1995·Granted Nov 3, 1998·362 cites·20 claims
- 3199US5806181AContact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 1997·Granted Sep 15, 1998·452 cites·21 claims
- 3299US5772451ASockets for electronic components and methods of connecting to electronic componentsFORMFACTOR INC·Filed 1995·Granted Jun 30, 1998·648 cites·92 claims
- 3399US5476211AMethod of manufacturing electrical contacts, using a sacrificial memberFORMFACTOR INC·Filed 1993·Granted Dec 19, 1995·670 cites·69 claims
- 3498US9316670B2Multiple contact probesFORMFACTOR INC·Filed 2015·Granted Apr 19, 2016·17 cites·10 claims
- 3598US8373428B2Probe card assembly and kit, and methods of making sameFORMFACTOR INC·Filed 2009·Granted Feb 12, 2013·75 cites·22 claims
- 3698US7889022B2Electromagnetically coupled interconnect system architectureFORMFACTOR INC·Filed 2009·Granted Feb 15, 2011·72 cites·20 claims
- 3798US7612630B2Electromagnetically coupled interconnect system architectureFORMFACTOR INC·Filed 2005·Granted Nov 3, 2009·84 cites·20 claims
- 3898US7048548B2Interconnect for microelectronic structures with enhanced spring characteristicsFORMFACTOR INC·Filed 2003·Granted May 23, 2006·102 cites·24 claims
- 3998US7002363B2Method and system for compensating thermally induced motion of probe cardsFORMFACTOR INC·Filed 2001·Granted Feb 21, 2006·187 cites·28 claims
- 4098US6891385B2Probe card cooling assembly with direct cooling of active electronic componentsFORMFACTOR INC·Filed 2001·Granted May 10, 2005·126 cites·16 claims
- 4198US6888362B2Test head assembly for electronic components with plurality of contoured microelectronic spring contactsFORMFACTOR INC·Filed 2001·Granted May 3, 2005·145 cites·32 claims
- 4298US6856150B2Probe card with coplanar daughter cardFORMFACTOR INC·Filed 2001·Granted Feb 15, 2005·132 cites·55 claims
- 4398US6836962B2Method and apparatus for shaping spring elementsFORMFACTOR INC·Filed 2000·Granted Jan 4, 2005·148 cites·5 claims
- 4498US6827584B2Interconnect for microelectronic structures with enhanced spring characteristicsFORMFACTOR INC·Filed 1999·Granted Dec 7, 2004·145 cites·19 claims
- 4598US6817052B2Apparatuses and methods for cleaning test probesFORMFACTOR INC·Filed 2001·Granted Nov 16, 2004·150 cites·10 claims
- 4698US6816031B1Adjustable delay transmission lineFORMFACTOR INC·Filed 2001·Granted Nov 9, 2004·115 cites·24 claims
- 4798US6798225B2Tester channel to multiple IC terminalsFORMFACTOR INC·Filed 2002·Granted Sep 28, 2004·116 cites·21 claims
- 4898US6791176B2Lithographic contact elementsFORMFACTOR INC·Filed 2001·Granted Sep 14, 2004·105 cites·38 claims
- 4998US6788094B2Wafer-level burn-in and testFORMFACTOR INC·Filed 2002·Granted Sep 7, 2004·95 cites·21 claims
- 5098US6727579B1Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structuresFORMFACTOR INC·Filed 2000·Granted Apr 27, 2004·203 cites·12 claims
Showing the top 50 of 536 patent records by PatentIndex Score.
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