Assignee

FU PENG

CN·1 granted patent·4 citations·filing 2011–2011

Technology mixH01L1 H10D1 H10W1

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0169US9337153B2EMI shielding and thermal dissipation for semiconductor deviceFU PENG·Filed 2011·Granted May 10, 2016·4 cites·21 claims

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