Assignee

FUJII TOMOYUKI

JP·2 granted patents·4 citations·filing 2008–2009

Technology mixY10T2 C08G1 C08K1 C08L1 C09J1 C23C1

Top patents by PatentIndex Score

2 records

0164US8414704B2Bonding structure and semiconductor device manufacturing apparatusFUJII TOMOYUKI·Filed 2009·Granted Apr 9, 2013·2 cites·11 claims
0257US9631128B2Bonding material and semiconductor supporting deviceFUJII TOMOYUKI·Filed 2008·Granted Apr 25, 2017·2 cites·4 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →