Assignee
FUJII YOSHIMARO
JP·6 granted patents·104 citations·filing 2003–2012
Top patents by PatentIndex Score
6 records- 0197US8314013B2Semiconductor chip manufacturing methodFUJII YOSHIMARO·Filed 2010·Granted Nov 20, 2012·23 cites·6 claims
- 0297US8304325B2Substrate dividing methodFUJII YOSHIMARO·Filed 2007·Granted Nov 6, 2012·25 cites·6 claims
- 0396US8518800B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·13 cites·7 claims
- 0495US8519511B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·10 cites·3 claims
- 0594US8518801B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·8 cites·4 claims
- 0691US8268704B2Method for dicing substrateFUJII YOSHIMARO·Filed 2003·Granted Sep 18, 2012·25 cites·56 claims
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