Assignee
FUJISAWA HIROYUKI
JP·2 granted patents·0 citations·filing 2007–2008
Top patents by PatentIndex Score
2 records- 0147US8846799B2Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring boardFUJISAWA HIROYUKI·Filed 2008·Granted Sep 30, 2014·0 cites·11 claims
- 0234US8194110B2Image recording apparatus for recording an image on an image recording mediumFUJISAWA HIROYUKI·Filed 2007·Granted Jun 5, 2012·0 cites·6 claims
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