Assignee
FUJISAWA SATOSHI
JP·3 granted patents·1 pending application·12 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0186US8557392B2Flexible copper clad laminateFUJISAWA SATOSHI·Filed 2009·Granted Oct 15, 2013·8 cites·5 claims
- 0278US8512873B2Surface treated copper foil and copper clad laminateFUJISAWA SATOSHI·Filed 2009·Granted Aug 20, 2013·4 cites·2 claims
- 0337US8852754B2Surface-treated copper foil, method for producing same, and copper clad laminated boardFUJISAWA SATOSHI·Filed 2011·Granted Oct 7, 2014·0 cites·9 claims
- 0436US2013084463A1Surface-treated roughened copper foil and copper clad laminateFUJISAWA SATOSHI·Filed 2011·Application pending·0 cites
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