Assignee
FUJIWARA JUNPEI
JP·4 granted patents·0 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0145US8999470B2Surface conductive laminated sheet and electronic part packaging containerFUJIWARA JUNPEI·Filed 2011·Granted Apr 7, 2015·0 cites·14 claims
- 0244US9028938B2Styrene resin composition, and molded article thereofFUJIWARA JUNPEI·Filed 2011·Granted May 12, 2015·0 cites·5 claims
- 0344US9028939B2Laminated sheet for packaging electronic component and molded body thereofFUJIWARA JUNPEI·Filed 2012·Granted May 12, 2015·0 cites·6 claims
- 0435US10202506B2Electronic component packaging sheet, and formed article thereofFUJIWARA JUNPEI·Filed 2011·Granted Feb 12, 2019·0 cites·10 claims
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