Assignee
FUKUDA METAL FOIL AND POWDER C
JP·5 granted patents·119 citations·filing 1991–1996
Top patents by PatentIndex Score
5 records- 0171US5567534AFoil for a printed circuitFUKUDA METAL FOIL AND POWDER C·Filed 1995·Granted Oct 22, 1996·30 cites·4 claims
- 0270US5338619ACopper foil for printed circuits and method of producing sameFUKUDA METAL FOIL AND POWDER C·Filed 1992·Granted Aug 16, 1994·30 cites·4 claims
- 0368US5700362AMethod of treating copper foil for printed circuitsFUKUDA METAL FOIL AND POWDER C·Filed 1996·Granted Dec 23, 1997·28 cites·22 claims
- 0461US5234573AMethod of surface treatment of copper foil for printed circuit boards and copper foil for printed circuit boardsFUKUDA METAL FOIL AND POWDER C·Filed 1991·Granted Aug 10, 1993·23 cites·5 claims
- 0542US5304428ACopper foil for printed circuit boardsFUKUDA METAL FOIL AND POWDER C·Filed 1993·Granted Apr 19, 1994·8 cites·1 claims
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