Assignee
FUKUDA METAL FOIL POWDER
JP·24 granted patents·2 pending applications·512 citations·filing 1979–2012
Top patents by PatentIndex Score
26 records- 0193US9340856B2Ni—Fe—Cr alloy and engine valve welded with the same alloyFUKUDA METAL FOIL POWDER·Filed 2012·Granted May 17, 2016·29 cites·9 claims
- 0290US5314659AHard facing chromium-base alloysFUKUDA METAL FOIL POWDER·Filed 1992·Granted May 24, 1994·44 cites·7 claims
- 0388US4387006AMethod of treating the surface of the copper foil used in printed wire boardsFUKUDA METAL FOIL POWDER·Filed 1981·Granted Jun 7, 1983·58 cites·8 claims
- 0481US6231742B1Electrolytic Copper foil and process for producing the sameFUKUDA METAL FOIL POWDER·Filed 1998·Granted May 15, 2001·52 cites·14 claims
- 0579US5262247AThin copper foil for printed wiring boardFUKUDA METAL FOIL POWDER·Filed 1992·Granted Nov 16, 1993·39 cites·2 claims
- 0679US4619871ACopper foil for printed circuit boardFUKUDA METAL FOIL POWDER·Filed 1984·Granted Oct 28, 1986·30 cites·6 claims
- 0775US5425822AHard facing chromium-base alloysFUKUDA METAL FOIL POWDER·Filed 1993·Granted Jun 20, 1995·20 cites·6 claims
- 0872US7789976B2Low surface roughness electrolytic copper foil and process for producing the sameFUKUDA METAL FOIL POWDER·Filed 2004·Granted Sep 7, 2010·8 cites·2 claims
- 0972US6585033B2Process for producing vanadium alloy foilFUKUDA METAL FOIL POWDER·Filed 2002·Granted Jul 1, 2003·8 cites·6 claims
- 1070US4981560AMethod of surface treatment of copper foil or a copper clad laminate for internal layerFUKUDA METAL FOIL POWDER·Filed 1989·Granted Jan 1, 1991·31 cites·16 claims
- 1170US4781980ACopper powder for use in conductive pasteFUKUDA METAL FOIL POWDER·Filed 1987·Granted Nov 1, 1988·34 cites·6 claims
- 1267US5817194ATin base soldering/brazing materialFUKUDA METAL FOIL POWDER·Filed 1997·Granted Oct 6, 1998·39 cites·12 claims
- 1366US6696017B2Ni-base brazing alloyFUKUDA METAL FOIL POWDER·Filed 2001·Granted Feb 24, 2004·12 cites·2 claims
- 1464US6616727B1Porous metal powderFUKUDA METAL FOIL POWDER·Filed 2000·Granted Sep 9, 2003·11 cites·4 claims
- 1564US4404049AHard facing nickel-base alloyFUKUDA METAL FOIL POWDER·Filed 1979·Granted Sep 13, 1983·14 cites·7 claims
- 1662US7179540B2Plate type heat exchanger and method for manufacture thereofFUKUDA METAL FOIL POWDER·Filed 2001·Granted Feb 20, 2007·6 cites·8 claims
- 1761US6419811B2Method for surface treatment of copper foilFUKUDA METAL FOIL POWDER·Filed 2001·Granted Jul 16, 2002·5 cites·2 claims
- 1859US6196480B1Ball mill, a method for preparing fine metal powder, and fine metal powder prepared by the methodFUKUDA METAL FOIL POWDER·Filed 1999·Granted Mar 6, 2001·15 cites·8 claims
- 1957US7037597B2Copper foil for printed-wiring boardFUKUDA METAL FOIL POWDER·Filed 2004·Granted May 2, 2006·6 cites·3 claims
- 2057US4425300AHard facing nickel-base alloyFUKUDA METAL FOIL POWDER·Filed 1981·Granted Jan 10, 1984·14 cites·4 claims
- 2152US6799608B1Bent pipe and a method for preparing thereofFUKUDA METAL FOIL POWDER·Filed 2000·Granted Oct 5, 2004·9 cites·7 claims
- 2249US5356528ACopper foil for printed circuits and method of producing sameFUKUDA METAL FOIL POWDER·Filed 1993·Granted Oct 18, 1994·13 cites·8 claims
- 2344US6524723B2Copper foil for printed circuit boards and its surface treatment methodFUKUDA METAL FOIL POWDER·Filed 2001·Granted Feb 25, 2003·3 cites·3 claims
- 2440US6336953B1Method for preparing metal powderFUKUDA METAL FOIL POWDER·Filed 1999·Granted Jan 8, 2002·12 cites·11 claims
- 2538US2006191798A1Electrolytic copper foil with low roughness surface and process for producing the sameFUKUDA METAL FOIL POWDER·Filed 2004·Application pending·0 cites
- 2638US2001004855A1Ball mill, a method for preparing fine metal powder, and fine metal powder prepared by the methodFUKUDA METAL FOIL POWDER·Filed 2000·Application pending·0 cites
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