Assignee
FUKUNAGA TAKAHIRO
JP·3 granted patents·1 pending application·10 citations·filing 2007–2009
Top patents by PatentIndex Score
4 records- 0165US9017822B2Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor deviceFUKUNAGA TAKAHIRO·Filed 2007·Granted Apr 28, 2015·5 cites·6 claims
- 0265US8723298B2Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the sameFUKUNAGA TAKAHIRO·Filed 2009·Granted May 13, 2014·3 cites·12 claims
- 0358US8946746B2Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing sameFUKUNAGA TAKAHIRO·Filed 2009·Granted Feb 3, 2015·2 cites·20 claims
- 0444US2010230696A1Wiring member, metal component with resin and resin sealed semiconductor device, and processes for producing themFUKUNAGA TAKAHIRO·Filed 2008·Application pending·0 cites
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