Assignee
FUKUSHIMA ATSUSHI
JP·5 granted patents·1 pending application·7 citations·filing 2006–2010
Top patents by PatentIndex Score
6 records- 0170US9441289B2High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered filmFUKUSHIMA ATSUSHI·Filed 2009·Granted Sep 13, 2016·1 cites·5 claims
- 0269US8728255B2Pot-shaped copper sputtering target and manufacturing method thereofFUKUSHIMA ATSUSHI·Filed 2006·Granted May 20, 2014·3 cites·15 claims
- 0368US8245398B2Method of shape forming a seal-ringFUKUSHIMA ATSUSHI·Filed 2009·Granted Aug 21, 2012·3 cites·5 claims
- 0457US9845528B2Tantalum sputtering targetFUKUSHIMA ATSUSHI·Filed 2010·Granted Dec 19, 2017·0 cites·18 claims
- 0555US10266924B2Tantalum sputtering targetFUKUSHIMA ATSUSHI·Filed 2010·Granted Apr 23, 2019·0 cites·4 claims
- 0642US2012037501A1Tantalum Sputtering TargetFUKUSHIMA ATSUSHI·Filed 2010·Application pending·0 cites
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