Assignee
FUKUYO FUMITSUGU
JP·20 granted patents·1 pending application·358 citations·filing 2003–2012
Top patents by PatentIndex Score
21 records- 0199US8283595B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2009·Granted Oct 9, 2012·68 cites·59 claims
- 0298US8227724B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2010·Granted Jul 24, 2012·31 cites·10 claims
- 0397US8183131B2Method of cutting an object to be processedFUKUYO FUMITSUGU·Filed 2009·Granted May 22, 2012·27 cites·9 claims
- 0496US8927900B2Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Jan 6, 2015·14 cites·5 claims
- 0596US8685838B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Apr 1, 2014·93 cites·9 claims
- 0695US8969761B2Method of cutting a wafer-like object and semiconductor chipFUKUYO FUMITSUGU·Filed 2010·Granted Mar 3, 2015·10 cites·47 claims
- 0794US8551865B2Method of cutting an object to be processedFUKUYO FUMITSUGU·Filed 2012·Granted Oct 8, 2013·10 cites·3 claims
- 0890US8263479B2Method for cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2003·Granted Sep 11, 2012·44 cites·39 claims
- 0988US8716110B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted May 6, 2014·3 cites·8 claims
- 1087US8946592B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 1187US8946591B2Method of manufacturing a semiconductor device formed using a substrate cutting methodFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 1287US8450187B2Method of cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2012·Granted May 28, 2013·6 cites·12 claims
- 1385US8247734B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Aug 21, 2012·29 cites·9 claims
- 1484US8598015B2Laser processing methodFUKUYO FUMITSUGU·Filed 2012·Granted Dec 3, 2013·3 cites·18 claims
- 1578US9488827B2Spectral deviceFUKUYO FUMITSUGU·Filed 2011·Granted Nov 8, 2016·6 cites·6 claims
- 1678US8937264B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted Jan 20, 2015·1 cites·5 claims
- 1778US8409968B2Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansionFUKUYO FUMITSUGU·Filed 2011·Granted Apr 2, 2013·3 cites·1 claims
- 1871US8890027B2Laser processing method and laser processing systemFUKUYO FUMITSUGU·Filed 2007·Granted Nov 18, 2014·4 cites·6 claims
- 1961US8946589B2Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Feb 3, 2015·0 cites·8 claims
- 2061US8933369B2Method of cutting a substrate and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Jan 13, 2015·0 cites·12 claims
- 2161US2012279947A1Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Application pending·0 cites
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