Assignee
FUNAOKA DAIKI
JP·1 granted patent·1 pending application·0 citations·filing 2012–2012
Top patents by PatentIndex Score
2 records- 0135US9139729B2Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic componentFUNAOKA DAIKI·Filed 2012·Granted Sep 22, 2015·0 cites·8 claims
- 0229US2014221578A1Resin composition for sealing electrical and electronic parts, method for producing sealed electrical and electronic parts, and sealed electrical and electronic partsFUNAOKA DAIKI·Filed 2012·Application pending·0 cites
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