Assignee
FUNAYA TAKUO
JP·1 granted patent·3 pending applications·25 citations·filing 2003–2011
Top patents by PatentIndex Score
4 records- 0187US8692135B2Wiring board capable of containing functional element and method for manufacturing sameFUNAYA TAKUO·Filed 2009·Granted Apr 8, 2014·25 cites·2 claims
- 0246US2010103634A1Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipmentFUNAYA TAKUO·Filed 2008·Application pending·0 cites
- 0336US2013237055A1Method of redistributing functional elementFUNAYA TAKUO·Filed 2011·Application pending·0 cites
- 0434US2006011702A1Solder and packaging therefromFUNAYA TAKUO·Filed 2003·Application pending·0 cites
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