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TW9 patents
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US8574698B2Nov 5, 2013
Water-based hot-foam adhesive panel
FUNG DEIN-RUN17 citations79
US8198347B2Jun 12, 2012
High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof
FUNG DEIN-RUN4 citations61
US9243132B2Jan 26, 2016
High-frequency copper foil covered substrate and compound material used therein
FUNG DEIN-RUN2 citations60
US8569442B2Oct 29, 2013
Hydrogenation process for improving yield of hydrogenated bisphenol-A-based epoxy resin
FUNG DEIN-RUN4 citations60
US8314186B2Nov 20, 2012
Adhesive composition for use in bonding of polarizing plate
FUNG DEIN-RUN3 citations57
US8653300B2Feb 18, 2014
Method for making hindered phenolic antioxidant
FUNG DEIN-RUN0 citations40
US8580879B2Nov 12, 2013
Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof
FUNG DEIN-RUN0 citations40
US8444871B2May 21, 2013
Slurry composition containing cracking agent
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US8653296B2Feb 18, 2014
Method for preparing ester of cyclohexane polycarboxylic acid from ester of benzene polycarboxylic acid
FUNG DEIN-RUN0 citations35