Assignee
FURUMIYA MASAYUKI
JP·5 granted patents·11 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0178US8330254B2Semiconductor deviceFURUMIYA MASAYUKI·Filed 2009·Granted Dec 11, 2012·6 cites·3 claims
- 0276US8338193B2Semiconductor deviceFURUMIYA MASAYUKI·Filed 2011·Granted Dec 25, 2012·2 cites·10 claims
- 0375US8188566B2Semiconductor integrated circuit deviceFURUMIYA MASAYUKI·Filed 2011·Granted May 29, 2012·3 cites·7 claims
- 0448US8481399B2Method of manufacturing semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portionFURUMIYA MASAYUKI·Filed 2011·Granted Jul 9, 2013·0 cites·12 claims
- 0540US8525269B2Semiconductor deviceFURUMIYA MASAYUKI·Filed 2010·Granted Sep 3, 2013·0 cites·15 claims
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