Assignee
GALERA MANOLITO FABRES
PH·1 granted patent·2 pending applications·4 citations·filing 2008–2010
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0168US8314480B2Stackable semiconductor package with embedded die in pre-molded carrier frameGALERA MANOLITO FABRES·Filed 2010·Granted Nov 20, 2012·4 cites·20 claims
- 0240US2010140773A1Stacked chip, micro-layered lead frame semiconductor packageGALERA MANOLITO FABRES·Filed 2008·Application pending·0 cites
- 0330US2011163428A1Semiconductor packages with embedded heat sinkGALERA MANOLITO FABRES·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →