Assignee
GAN KAH WEE
SG·6 granted patents·1 pending application·78 citations·filing 2010–2011
Top patents by PatentIndex Score
7 records- 0194US8779601B2Embedded wafer level package for 3D and package-on-package applications, and method of manufactureGAN KAH WEE·Filed 2011·Granted Jul 15, 2014·34 cites·10 claims
- 0293US8916481B2Embedded wafer level package for 3D and package-on-package applications, and method of manufactureGAN KAH WEE·Filed 2011·Granted Dec 23, 2014·33 cites·25 claims
- 0382US8617987B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2010·Granted Dec 31, 2013·7 cites·9 claims
- 0470US8766422B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2011·Granted Jul 1, 2014·3 cites·3 claims
- 0561US8728831B2Reconstituted wafer warpage adjustmentGAN KAH WEE·Filed 2010·Granted May 20, 2014·1 cites·15 claims
- 0638US8912653B2Plasma treatment on semiconductor wafersGAN KAH WEE·Filed 2011·Granted Dec 16, 2014·0 cites·13 claims
- 0735US2012168943A1Plasma treatment on semiconductor wafersGAN KAH WEE·Filed 2010·Application pending·0 cites
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