P

Assignee

GEORGE GREGORY

US9 patents

Top patents by PatentIndex Score

US8551291B2Oct 8, 2013

Debonding equipment and methods for debonding temporary bonded wafers

GEORGE GREGORY16 citations92
US8267143B2Sep 18, 2012

Apparatus for mechanically debonding temporary bonded semiconductor wafers

GEORGE GREGORY23 citations90
US8147630B2Apr 3, 2012

Method and apparatus for wafer bonding with enhanced wafer mating

GEORGE GREGORY19 citations84
US8139219B2Mar 20, 2012

Apparatus and method for semiconductor wafer alignment

GEORGE GREGORY15 citations84
US8764026B2Jul 1, 2014

Device for centering wafers

GEORGE GREGORY8 citations79
US8425715B2Apr 23, 2013

Apparatus for high throughput wafer bonding

GEORGE GREGORY3 citations62
US8919412B2Dec 30, 2014

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

GEORGE GREGORY3 citations60
US8574398B2Nov 5, 2013

Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers

GEORGE GREGORY1 citations52
US9064686B2Jun 23, 2015

Method and apparatus for temporary bonding of ultra thin wafers

GEORGE GREGORY1 citations49