Assignee
GLOBAL ADVANCED PACKAGING TECH
HK·5 granted patents·24 citations·filing 2003–2004
Top patents by PatentIndex Score
5 records- 0164US6937477B2Structure of gold fingersGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 30, 2005·12 cites·5 claims
- 0256US7098524B2Electroplated wire layout for package sawingGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 29, 2006·10 cites·7 claims
- 0339US7095091B2Packaging stacked chips with finger structureGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 22, 2006·1 cites·6 claims
- 0435US7091590B2Multiple stacked-chip packaging structureGLOBAL ADVANCED PACKAGING TECH·Filed 2003·Granted Aug 15, 2006·0 cites·5 claims
- 0525US6933592B2Substrate structure capable of reducing package singular stressGLOBAL ADVANCED PACKAGING TECH·Filed 2003·Granted Aug 23, 2005·1 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →