Assignee
GOIDA THOMAS
US3 patents
Top patents by PatentIndex Score
US8447057B2May 21, 2013
Packages and methods for packaging MEMS microphone devices
GOIDA THOMAS34 citations87
US8946879B2Feb 3, 2015
Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
GOIDA THOMAS7 citations80
US9215519B2Dec 15, 2015
Reduced footprint microphone system with spacer member having through-hole
GOIDA THOMAS3 citations59