Assignee
GONG ZHIWEI
US·9 granted patents·1 pending application·173 citations·filing 2010–2014
Top patents by PatentIndex Score
10 records- 0197US8916421B2Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduitsGONG ZHIWEI·Filed 2011·Granted Dec 23, 2014·65 cites·17 claims
- 0295US9257393B1Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereofGONG ZHIWEI·Filed 2014·Granted Feb 9, 2016·18 cites·18 claims
- 0394US9673150B2EMI/RFI shielding for semiconductor device packagesGONG ZHIWEI·Filed 2014·Granted Jun 6, 2017·18 cites·18 claims
- 0494US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0590US8329509B2Packaging process to create wettable lead flank during board assemblyGONG ZHIWEI·Filed 2010·Granted Dec 11, 2012·21 cites·20 claims
- 0688US8597983B2Semiconductor device packaging having substrate with pre-encapsulation through via formationGONG ZHIWEI·Filed 2011·Granted Dec 3, 2013·10 cites·13 claims
- 0787US9093457B2Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereofGONG ZHIWEI·Filed 2012·Granted Jul 28, 2015·10 cites·13 claims
- 0886US9142502B2Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduitsGONG ZHIWEI·Filed 2011·Granted Sep 22, 2015·9 cites·13 claims
- 0944US9034697B2Apparatus and methods for quad flat no lead packagingGONG ZHIWEI·Filed 2011·Granted May 19, 2015·0 cites·10 claims
- 1039US2013049218A1Semiconductor device packaging having pre-encapsulation through via formationGONG ZHIWEI·Filed 2011·Application pending·0 cites
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