Assignee
GRILLBERGER MICHAEL
DE3 patents
Top patents by PatentIndex Score
US8482123B2Jul 9, 2013
Stress reduction in chip packaging by using a low-temperature chip-package connection regime
GRILLBERGER MICHAEL2 citations60
US8920027B2Dec 30, 2014
Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems
GRILLBERGER MICHAEL1 citations48
US8501545B2Aug 6, 2013
Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime
GRILLBERGER MICHAEL1 citations48