Assignee
GUNDERSON NEAL FRANK
US·4 granted patents·36 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0193US8879263B2Conducting heat away from a printed circuit board assembly in an enclosureGUNDERSON NEAL FRANK·Filed 2012·Granted Nov 4, 2014·17 cites·22 claims
- 0290US9078357B2Internal cover thermal conductionGUNDERSON NEAL FRANK·Filed 2012·Granted Jul 7, 2015·13 cites·20 claims
- 0375US8305770B2PCBA low cost frame mountGUNDERSON NEAL FRANK·Filed 2010·Granted Nov 6, 2012·4 cites·12 claims
- 0467US8646781B2Heat-assisted hermetic spring sealGUNDERSON NEAL FRANK·Filed 2008·Granted Feb 11, 2014·2 cites·19 claims
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