Assignee
GUTH KARSTEN
DE·4 granted patents·5 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0162US8415207B2Module including a sintered joint bonding a semiconductor chip to a copper surfaceGUTH KARSTEN·Filed 2012·Granted Apr 9, 2013·1 cites·19 claims
- 0262US8253233B2Module including a sintered joint bonding a semiconductor chip to a copper surfaceGUTH KARSTEN·Filed 2008·Granted Aug 28, 2012·2 cites·24 claims
- 0359US8104667B2Method for connecting a component with a substrateGUTH KARSTEN·Filed 2010·Granted Jan 31, 2012·2 cites·20 claims
- 0442US9214442B2Power semiconductor module, method for producing a power semiconductor module, and semiconductor chipGUTH KARSTEN·Filed 2007·Granted Dec 15, 2015·0 cites·20 claims
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