Assignee
HA JONG-WOO
KR·10 granted patents·1 pending application·50 citations·filing 2006–2011
Top patents by PatentIndex Score
11 records- 0189US8531043B2Planar encapsulation and mold cavity package in package systemHA JONG-WOO·Filed 2008·Granted Sep 10, 2013·18 cites·18 claims
- 0284US8405197B2Integrated circuit packaging system with stacked configuration and method of manufacture thereofHA JONG-WOO·Filed 2009·Granted Mar 26, 2013·12 cites·20 claims
- 0378US8810018B2Stacked integrated circuit package system with face to face stack configurationHA JONG-WOO·Filed 2006·Granted Aug 19, 2014·8 cites·10 claims
- 0471US9236319B2Stacked integrated circuit package systemHA JONG-WOO·Filed 2008·Granted Jan 12, 2016·5 cites·16 claims
- 0569US8211746B2Integrated circuit packaging system with lead frame and method of manufacture thereofHA JONG-WOO·Filed 2011·Granted Jul 3, 2012·2 cites·20 claims
- 0663US8823160B2Integrated circuit package system having cavityHA JONG-WOO·Filed 2008·Granted Sep 2, 2014·2 cites·20 claims
- 0763US8143104B2Method for manufacturing ball grid array package stacking systemHA JONG-WOO·Filed 2011·Granted Mar 27, 2012·1 cites·10 claims
- 0862US8642383B2Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wiresHA JONG-WOO·Filed 2006·Granted Feb 4, 2014·2 cites·5 claims
- 0947US8987056B2Integrated circuit package system with support carrier and method of manufacture thereofHA JONG-WOO·Filed 2008·Granted Mar 24, 2015·0 cites·19 claims
- 1045US2010244212A1Integrated circuit packaging system with post type interconnector and method of manufacture thereofHA JONG-WOO·Filed 2009·Application pending·0 cites
- 1140US8481420B2Integrated circuit packaging system with lead frame stacking module and method of manufacture thereofHA JONG-WOO·Filed 2011·Granted Jul 9, 2013·0 cites·5 claims
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