Assignee
HABA BELGACEM
US60 patents
Top patents by PatentIndex Score
US8728865B2May 20, 2014
Microelectronic packages and methods therefor
HABA BELGACEM88 citations99
US8680684B2Mar 25, 2014
Stackable microelectronic package structures
HABA BELGACEM89 citations99
US8525314B2Sep 3, 2013
Stacked packaging improvements
HABA BELGACEM98 citations99
US8482111B2Jul 9, 2013
Stackable molded microelectronic packages
HABA BELGACEM121 citations99
US8093697B2Jan 10, 2012
Microelectronic packages and methods therefor
HABA BELGACEM117 citations99
US8058101B2Nov 15, 2011
Microelectronic packages and methods therefor
HABA BELGACEM87 citations99
US8916781B2Dec 23, 2014
Cavities containing multi-wiring structures and devices
HABA BELGACEM43 citations98
US8841765B2Sep 23, 2014
Multi-chip module with stacked face-down connected dies
HABA BELGACEM64 citations98
US8637991B2Jan 28, 2014
Microelectronic package with terminals on dielectric mass
HABA BELGACEM37 citations98
US8580607B2Nov 12, 2013
Microelectronic packages with nanoparticle joining
HABA BELGACEM49 citations98
US8513817B2Aug 20, 2013
Memory module in a package
HABA BELGACEM65 citations98
US8330272B2Dec 11, 2012
Microelectronic packages with dual or multiple-etched flip-chip connectors
HABA BELGACEM66 citations98
US8207604B2Jun 26, 2012
Microelectronic package comprising offset conductive posts on compliant layer
HABA BELGACEM93 citations98
US8076788B2Dec 13, 2011
Off-chip vias in stacked chips
HABA BELGACEM74 citations98
US8329581B2Dec 11, 2012
Microelectronic packages and methods therefor
HABA BELGACEM45 citations97
US8071424B2Dec 6, 2011
Substrate for a microelectronic package and method of fabricating thereof
HABA BELGACEM49 citations96
US8823165B2Sep 2, 2014
Memory module in a package
HABA BELGACEM34 citations94
US8697492B2Apr 15, 2014
No flow underfill
HABA BELGACEM36 citations94
US8680662B2Mar 25, 2014
Wafer level edge stacking
HABA BELGACEM38 citations94
US8338963B2Dec 25, 2012
Multiple die face-down stacking for two or more die
HABA BELGACEM51 citations94
US8193615B2Jun 5, 2012
Semiconductor packaging process using through silicon vias
HABA BELGACEM42 citations94
US8304881B1Nov 6, 2012
Flip-chip, face-up and face-down wirebond combination package
HABA BELGACEM28 citations93
US8780576B2Jul 15, 2014
Low CTE interposer
HABA BELGACEM12 citations92
US8461672B2Jun 11, 2013
Reconstituted wafer stack packaging with after-applied pad extensions
HABA BELGACEM27 citations92
US8405196B2Mar 26, 2013
Chips having rear contacts connected by through vias to front contacts
HABA BELGACEM33 citations92
US8310036B2Nov 13, 2012
Chips having rear contacts connected by through vias to front contacts
HABA BELGACEM27 citations92
US9159708B2Oct 13, 2015
Stackable molded microelectronic packages with area array unit connectors
HABA BELGACEM7 citations84
US8928153B2Jan 6, 2015
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
HABA BELGACEM13 citations84
US8787032B2Jul 22, 2014
Enhanced stacked microelectronic assemblies with central contacts
HABA BELGACEM7 citations84
US8709933B2Apr 29, 2014
Interposer having molded low CTE dielectric
HABA BELGACEM8 citations84
US8641913B2Feb 4, 2014
Fine pitch microcontacts and method for forming thereof
HABA BELGACEM17 citations84
US8637968B2Jan 28, 2014
Stacked microelectronic assembly having interposer connecting active chips
HABA BELGACEM14 citations84
US8623706B2Jan 7, 2014
Microelectronic package with terminals on dielectric mass
HABA BELGACEM4 citations84
US8513789B2Aug 20, 2013
Edge connect wafer level stacking with leads extending along edges
HABA BELGACEM10 citations84
US8461673B2Jun 11, 2013
Edge connect wafer level stacking
HABA BELGACEM6 citations84
US8431435B2Apr 30, 2013
Edge connect wafer level stacking
HABA BELGACEM12 citations84
US8222725B2Jul 17, 2012
Metal can impedance control structure
HABA BELGACEM7 citations84
US8067267B2Nov 29, 2011
Microelectronic assemblies having very fine pitch stacking
HABA BELGACEM14 citations84
US8575766B2Nov 5, 2013
Microelectronic assembly with impedance controlled wirebond and conductive reference element
HABA BELGACEM6 citations83
US8476774B2Jul 2, 2013
Off-chip VIAS in stacked chips
HABA BELGACEM4 citations74
US8426957B2Apr 23, 2013
Edge connect wafer level stacking
HABA BELGACEM4 citations74
US8786083B2Jul 22, 2014
Impedance controlled packages with metal sheet or 2-layer RDL
HABA BELGACEM5 citations73
US8735287B2May 27, 2014
Semiconductor packaging process using through silicon vias
HABA BELGACEM4 citations73
US8253259B2Aug 28, 2012
Microelectronic assembly with impedance controlled wirebond and reference wirebond
HABA BELGACEM5 citations72
US8772908B2Jul 8, 2014
Conductive pads defined by embedded traces
HABA BELGACEM3 citations63
US8569884B2Oct 29, 2013
Multiple die in a face down package
HABA BELGACEM4 citations63
US8553420B2Oct 8, 2013
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
HABA BELGACEM1 citations63
US8531020B2Sep 10, 2013
Stacked packaging improvements
HABA BELGACEM2 citations63
US8410618B2Apr 2, 2013
Microelectronic assembly with joined bond elements having lowered inductance
HABA BELGACEM3 citations63
US8885356B2Nov 11, 2014
Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
HABA BELGACEM0 citations52
Showing the top 50 of 60 patents by PatentIndex Score.