Assignee
HABU TAKASHI
JP2 patents
Top patents by PatentIndex Score
US8546958B2Oct 1, 2013
Pressure-sensitive adhesive sheet for protecting semiconductor wafer
HABU TAKASHI0 citations43
US8388786B2Mar 5, 2013
Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet
HABU TAKASHI0 citations33