Assignee
HAJI HIROSHI
JP·3 granted patents·24 citations·filing 2006–2009
Top patents by PatentIndex Score
3 records- 0183US8192578B2Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing methodHAJI HIROSHI·Filed 2006·Granted Jun 5, 2012·10 cites·16 claims
- 0280US8614118B2Component bonding method, component laminating method and bonded component structureHAJI HIROSHI·Filed 2007·Granted Dec 24, 2013·11 cites·6 claims
- 0370US8158494B2Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layerHAJI HIROSHI·Filed 2009·Granted Apr 17, 2012·3 cites·3 claims
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