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HAMPP ANDREAS

US3 patents

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US8154099B2Apr 10, 2012

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate

HAMPP ANDREAS7 citations73
US8709949B2Apr 29, 2014

System and method for removing oxide from a sensor clip assembly

HAMPP ANDREAS5 citations59
US8094361B2Jan 10, 2012

Polymer shutter compositions and devices for infrared systems

HAMPP ANDREAS4 citations55