Assignee
HANA MICRON INC
KR·8 granted patents·8 pending applications·126 citations·filing 2003–2023
Top patents by PatentIndex Score
16 records- 0195US6926544B2Flash memory apparatus having single body type rotary coverHANA MICRON INC·Filed 2003·Granted Aug 9, 2005·95 cites·24 claims
- 0283US6914388B2Organic light emitting diode display device driving apparatus and driving method thereofHANA MICRON INC·Filed 2003·Granted Jul 5, 2005·26 cites·11 claims
- 0375US10679930B2Metal core solder ball interconnector fan-out wafer level packageHANA MICRON INC·Filed 2016·Granted Jun 9, 2020·3 cites·6 claims
- 0459US2025096097A1Semiconductor package and method for manufacturing sameHANA MICRON INC·Filed 2023·Application pending·0 cites
- 0554US10146970B2RFID readerHANA MICRON INC·Filed 2017·Granted Dec 4, 2018·1 cites·7 claims
- 0653US9538724B2Ear tag for recognizing livestock individualHANA MICRON INC·Filed 2014·Granted Jan 10, 2017·1 cites·6 claims
- 0745US2016268226A1Method for Manufacturing Electronic ComponentHANA MICRON INC·Filed 2014·Application pending·0 cites
- 0844US9572247B2Memory card systems comprising flexible integrated circuit element packages, and methods for manufacturing said memory card systemsHANA MICRON INC·Filed 2013·Granted Feb 14, 2017·0 cites·12 claims
- 0943US9536817B2Electronic devices and methods of manufacturing electronic devicesHANA MICRON INC·Filed 2015·Granted Jan 3, 2017·0 cites·13 claims
- 1041US9887163B2Semiconductor package and method of manufacturing the sameHANA MICRON INC·Filed 2016·Granted Feb 6, 2018·0 cites·6 claims
- 1140US2015333040A1Semiconductor device packageHANA MICRON INC·Filed 2013·Application pending·0 cites
- 1240US2017193264A1Trackpad semiconductor package of smart device and manufacturing method of sameHANA MICRON INC·Filed 2016·Application pending·0 cites
- 1340US2019311999A1Semiconductor device and wafer-level package each having redistribution structure, and method of manufacturing semiconductor deviceHANA MICRON INC·Filed 2018·Application pending·0 cites
- 1437US2017192542A1Track pad semiconductor package using compression molding and method for manufacturing the sameHANA MICRON INC·Filed 2017·Application pending·0 cites
- 1535US2016192500A1Electronic Devices and Methods of Manufacturing Electronic DevicesHANA MICRON INC·Filed 2015·Application pending·0 cites
- 1626US2015359098A1Circuit Board Having Interposer Embedded Therein, Electronic Module Using Same, and Method for Manufacturing SameHANA MICRON INC·Filed 2013·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →