Assignee
HANAFUSA MIKIO
JP·1 granted patent·3 pending applications·1 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0159US2010084275A1Copper electrolytic solution and two-layer flexible substrate obtained using the sameHANAFUSA MIKIO·Filed 2008·Application pending·0 cites
- 0254US8470450B2Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminateHANAFUSA MIKIO·Filed 2008·Granted Jun 25, 2013·1 cites·5 claims
- 0353US2012189811A1Copper electrolytic solution and two-layer flexible substrate obtained using the sameHANAFUSA MIKIO·Filed 2012·Application pending·0 cites
- 0438US2011311834A1Two-layer flexible substrate, and copper electrolytic solution for producing sameHANAFUSA MIKIO·Filed 2010·Application pending·0 cites
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