Assignee
HANAOKA KAZUYA
JP·9 granted patents·73 citations·filing 2009–2012
Top patents by PatentIndex Score
9 records- 0195US8404563B2Method for reprocessing semiconductor substrate and method for manufacturing SOI substrateHANAOKA KAZUYA·Filed 2010·Granted Mar 26, 2013·21 cites·21 claims
- 0291US8222097B2Method for manufacturing semiconductor deviceHANAOKA KAZUYA·Filed 2009·Granted Jul 17, 2012·19 cites·23 claims
- 0391US8168481B2Method of manufacturing SOI substrateHANAOKA KAZUYA·Filed 2010·Granted May 1, 2012·14 cites·13 claims
- 0489US9123529B2Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrateHANAOKA KAZUYA·Filed 2012·Granted Sep 1, 2015·11 cites·18 claims
- 0575US8111198B2Semiconductor deviceHANAOKA KAZUYA·Filed 2010·Granted Feb 7, 2012·3 cites·16 claims
- 0674US8530973B2Method for manufacturing semiconductor deviceHANAOKA KAZUYA·Filed 2012·Granted Sep 10, 2013·3 cites·18 claims
- 0759US8415228B2Manufacturing method of SOI substrate and semiconductor deviceHANAOKA KAZUYA·Filed 2009·Granted Apr 9, 2013·2 cites·46 claims
- 0849US8486772B2Method of manufacturing SOI substrateHANAOKA KAZUYA·Filed 2012·Granted Jul 16, 2013·0 cites·22 claims
- 0940US8278187B2Method for reprocessing semiconductor substrate by stepwise etching with at least two etching treatmentsHANAOKA KAZUYA·Filed 2010·Granted Oct 2, 2012·0 cites·14 claims
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