Assignee
HASHII TOMOHIRO
JP2 patents
Top patents by PatentIndex Score
US8092277B2Jan 10, 2012
Method of grinding semiconductor wafers, grinding surface plate, and grinding device
HASHII TOMOHIRO4 citations56
US9550264B2Jan 24, 2017
Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
HASHII TOMOHIRO0 citations35