Individual holder
HATA WILLIAM Y
US·3 granted patents·1 citations·filing 2009–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
3 records- 0156US9267985B2Bond and probe pad distributionHATA WILLIAM Y·Filed 2009·Granted Feb 23, 2016·1 cites·18 claims
- 0249US8148813B2Integrated circuit package architectureHATA WILLIAM Y·Filed 2009·Granted Apr 3, 2012·0 cites·17 claims
- 0348US8772085B2Integrated circuit package architectureHATA WILLIAM Y·Filed 2012·Granted Jul 8, 2014·0 cites·20 claims
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