Individual holder
HAUENSTEIN HENNING M
US·7 granted patents·1 pending application·35 citations·filing 2007–2011
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
8 records- 0187US8987777B2Stacked half-bridge power moduleHAUENSTEIN HENNING M·Filed 2011·Granted Mar 24, 2015·9 cites·20 claims
- 0284US8569883B2Package for high power devicesHAUENSTEIN HENNING M·Filed 2011·Granted Oct 29, 2013·4 cites·18 claims
- 0381US8680666B2Bond wireless power module with double-sided single device cooling and immersion bath coolingHAUENSTEIN HENNING M·Filed 2007·Granted Mar 25, 2014·10 cites·20 claims
- 0474US8102668B2Semiconductor device package with internal device protectionHAUENSTEIN HENNING M·Filed 2008·Granted Jan 24, 2012·6 cites·17 claims
- 0571US8637981B2Dual compartment semiconductor package with temperature sensorHAUENSTEIN HENNING M·Filed 2011·Granted Jan 28, 2014·2 cites·10 claims
- 0667US9001518B2Power module with press-fit clampsHAUENSTEIN HENNING M·Filed 2011·Granted Apr 7, 2015·2 cites·20 claims
- 0767US8804340B2Power semiconductor package with double-sided coolingHAUENSTEIN HENNING M·Filed 2011·Granted Aug 12, 2014·2 cites·20 claims
- 0841US2007257343A1Die-on-leadframe (dol) with high voltage isolationHAUENSTEIN HENNING M·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →