Assignee
HAYAKAWA AKINOBU
JP·2 granted patents·1 pending application·0 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0130US8901207B2Adhesive for electronic componentsHAYAKAWA AKINOBU·Filed 2010·Granted Dec 2, 2014·0 cites·6 claims
- 0229US8563362B2Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particlesHAYAKAWA AKINOBU·Filed 2010·Granted Oct 22, 2013·0 cites·16 claims
- 0329US2013199613A1Ink for active layer of organic solar cell, organic solar cell, and process for manufacture of organic solar cellHAYAKAWA AKINOBU·Filed 2011·Application pending·0 cites
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