Assignee
HAYASHI KATSURA
JP·5 granted patents·2 pending applications·16 citations·filing 2007–2011
Top patents by PatentIndex Score
7 records- 0178US8461462B2Circuit substrate, laminated board and laminated sheetHAYASHI KATSURA·Filed 2010·Granted Jun 11, 2013·4 cites·10 claims
- 0276US8802996B2Wiring board and mounting structure thereofHAYASHI KATSURA·Filed 2011·Granted Aug 12, 2014·3 cites·9 claims
- 0370US8446734B2Circuit board and mounting structureHAYASHI KATSURA·Filed 2007·Granted May 21, 2013·6 cites·4 claims
- 0466US8975529B2Interposer and electronic device using the sameHAYASHI KATSURA·Filed 2011·Granted Mar 10, 2015·2 cites·14 claims
- 0560US9485877B2Structure for circuit board used in electronic devices and method for manufacturing the sameHAYASHI KATSURA·Filed 2010·Granted Nov 1, 2016·1 cites·12 claims
- 0644US2013149514A1Insulating sheet, method of manufacturing the same, and method of manufacturing structure using the insulating sheetHAYASHI KATSURA·Filed 2011·Application pending·0 cites
- 0743US2012189818A1Structure and method for manufacturing the sameHAYASHI KATSURA·Filed 2010·Application pending·0 cites
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