Assignee
HEINZE DYCONEX PATENTE
CH·14 granted patents·538 citations·filing 1993–1999
Top patents by PatentIndex Score
14 records- 0193US5436062AProcess for the production of printed circuit boards with extremely dense wiring using a metal-clad laminateHEINZE DYCONEX PATENTE·Filed 1993·Granted Jul 25, 1995·98 cites·13 claims
- 0292US6486394B1Process for producing connecting conductorsHEINZE DYCONEX PATENTE·Filed 1997·Granted Nov 26, 2002·94 cites·16 claims
- 0385US5457881AMethod for the through plating of conductor foilsHEINZE DYCONEX PATENTE·Filed 1994·Granted Oct 17, 1995·58 cites·5 claims
- 0479US5442143ACore for electrical connecting substrates and electrical connecting substrates with core, as well as process for the production thereofHEINZE DYCONEX PATENTE·Filed 1994·Granted Aug 15, 1995·45 cites·7 claims
- 0577US5698299AThin laminated microstructure with precisely aligned openingsHEINZE DYCONEX PATENTE·Filed 1995·Granted Dec 16, 1997·52 cites·13 claims
- 0675US6162996AInsulating foil circuit board with rigid and flexible sectionsHEINZE DYCONEX PATENTE·Filed 1994·Granted Dec 19, 2000·39 cites·4 claims
- 0774US5729897AMethod of manufacturing multilayer foil printed circuit boardsHEINZE DYCONEX PATENTE·Filed 1994·Granted Mar 24, 1998·38 cites·24 claims
- 0865US5639389AProcess for the production of structuresHEINZE DYCONEX PATENTE·Filed 1995·Granted Jun 17, 1997·27 cites·10 claims
- 0957US5378314AMethod for producing substrates with passagesHEINZE DYCONEX PATENTE·Filed 1993·Granted Jan 3, 1995·19 cites·7 claims
- 1055US6601297B1Method for producing micro-openingsHEINZE DYCONEX PATENTE·Filed 1999·Granted Aug 5, 2003·17 cites·14 claims
- 1155US5746929AProcess for structuring polymer filmsHEINZE DYCONEX PATENTE·Filed 1997·Granted May 5, 1998·17 cites·15 claims
- 1247US6321443B1Connection substrateHEINZE DYCONEX PATENTE·Filed 1996·Granted Nov 27, 2001·19 cites·6 claims
- 1339US6218628B1Foil circuit boards and semifinished products and method for the manufacture thereofHEINZE DYCONEX PATENTE·Filed 1994·Granted Apr 17, 2001·10 cites·16 claims
- 1434US5651899AStructuring of printed circuit boardsHEINZE DYCONEX PATENTE·Filed 1995·Granted Jul 29, 1997·5 cites·14 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →