Assignee
HENDERSON BRIAN M
US·3 granted patents·8 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0166US8319325B2Intra-die routing using back side redistribution layer and associated methodHENDERSON BRIAN M·Filed 2009·Granted Nov 27, 2012·6 cites·33 claims
- 0260US8198736B2Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assemblyHENDERSON BRIAN M·Filed 2009·Granted Jun 12, 2012·2 cites·13 claims
- 0347US8604626B2Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assemblyHENDERSON BRIAN M·Filed 2012·Granted Dec 10, 2013·0 cites·8 claims
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